Patent No. U.S. 7,645,831 B2
Henkel AG & Co. has obtained a patent for a moisture curable hot melt adhesive composition prepared by reacting a polyisocyanate with a mixture comprised of a urethane diol and  a polyether polyol or polyester diol or both. The urethane diol being the reaction product of a cyclic carbonate and a compound containing an amino group and a further group selected from the group consisting of amino groups and hydroxyl groups, which composition, in the presence of moisture, cures to an irreversible solid form.